BlueWow Mobile Phone Cooling Plate Heat Sink Expend Cooling Area for Cooling fans Game Cooler Cell Phone

Product name: Composite uniform heat plate Product size: 6010628mm Product category: ordinary models (with semiconductor cooling back clip use, back material conductive silicon paper) Magnetic models (universal magnetic models and back clip models heat sink use, back of the material double-sided adhesive) How to use: Attach to the back of the phone, with the use of heat sink, increase the heat dissipation area, to achieve the phone CPU and camera cooling. The magnetic absorbing product is embedded inside the magnetic sheet, seamlessly pasted, the magnetic absorbing radiator can be directly adsorbed to use.