VOKTTA Tin Solder Paste 138℃ 217°℃ Melting Point No-Clean Welding Soldering Tin for Electronics PCB IC CPU LED BGA Repairing

VOKTTA. Features: 1. The product has good wettability, strong resistance to dryness, and a relatively long shelf life at room temperature. It is suitable for the mobile phone repair industry, computer digital repair industry, high-precision circuit board SMT welding, BGA process welding, and so on!. 2. The solder joints are bright and full without false soldering, with little residue. The solder joints are bright and have strong soldering resistance, good conductivity, and are resistant to oxidation, corrosion, and cleaning, The use of highly efficient thixotropic agents can effectively prevent collapse during printing and preheating, and special soldering flux ensures good printing and fine patterns. 3. High quality, unique formula, perfect performance, easy to solder, bright and full soldering, no false soldering or other phenomena, The residue is colorless and transparent, does not affect the detection, and has excellent washing and cleaning performance. 4. New technical support, un