BGA PCB No-Clean Solder Paste Welding Advanced Oil Flux Grease 10cc Soldering Repair Paste NC-559-ASM

🔥KEK Professional BGA Rework Syringe Solder Paste｜NC-559-ASM Flux Paste🌟Core Selling Points✅ BGA Rework Special：Designed for Ball Grid Array packaging, high-viscosity paste precisely positions solder balls to avoid misalignment!✅ Syringe Volume Control：0.1ml micro-droplet precision extrusion, eliminate waste – suitable for 0.3mm 以下 ultra-fine solder joints!✅ Low Residue & No Clean：Stable active ingredients, minimal post-soldering residue, RoHS compliant, motherboard-friendly!📏SpecificationsItemDetailsProduct NameKEK Syringe Solder Paste (BGA Rework Special)ModelNC-559-ASM Flux PasteCapacity30ml (with precision needle tube)Viscosity1,200,000 mPa·s (high-viscosity formula)Melting Point183℃ (compatible with lead-free/lead solder)PackagingIndividually sealed syringe, anti-dry & moisture-proof🔧Professional Advantages✨ BGA Ball Mounting Master：Strong paste adhesion improves solder ball positioning success rate by 90%High-temperature resistant formula, no collapse after multiple reflowsSuitable for 0.4mm-1.27mm solder balls of various diameters✨ Full Welding Scenario Coverage：✅ BGA chip ball mounting　✅ PCB component soldering　✅ Mobile/computer motherboard repair　✅ Automotive electronics💡Why Choose KEK?✅ Certified Quality：IPC-J-STD-004B certified, meets industrial standards✅ Beginner-Friendly：Spiral push rod design ensures uniform extrusion – easy for beginners✅ Cost-Effective：30ml large capacity ≈ 500 BGA ball mountings, cost per use as low📌Usage Steps▌Step 1：Evenly apply solder paste on BGA pads▌Step 2：Align stencil with pads, place solder balls▌Step 3：Heat with hot air gun until balls melt, cool naturally