Heat Resistant Silicone Thermals Transfer Pad Universal Size for PC Component Cooling Applications

high Thermals conductivity, allowing the device to quickly cool down and preventing gamers from experiencing high frequency lag. for various, including graphics memory bridge, RDRAM memory module, communication devices, SSDs solidstatedrive, automotive control devices, and game console equipment. Insulation is nonconductive and not damage electronic components. Heat Resistant Silicone Thermals Transfer Pad Universal Size for PC Component Cooling Applications Features: high Thermals conductivity, allowing the device to quickly cool down and preventing gamers from experiencing high frequency lag. for various, including graphics memory bridge, RDRAM memory module, communication devices, SSDs solidstatedrive, automotive control devices, and game console equipment. Insulation is nonconductive and not damage electronic components. Multiple thickness available for cutting. Good elasticity and compressibility can perfectly fill electronic components for air strikes, maximizing Thermals conduct