YCS Mr.Yang IC Chip Degumming Station Dual Thickness 0.2mm/0.4mm Stepless Adjustment for BGA CPU IC Glue Removal Phone Repair

YCS Mr.Yang IC Chip Degumming Station Dual Thickness 0.2mm/0.4mm Stepless Adjustment for BGA CPU IC Glue Removal Phone Repair
🔧 Dual Thickness 0.2mm 0.4mmSwitch between thicknesses for thin and thick ICs. Precise adaptation for all chips.🛡️ Secure Clamping No SlippingHeavy brushing and hot air won't move the chip. Stable and reliable.⚙️ Stepless Spacing AdjustmentPrecisely tune clamping width. Compatible with chips of all sizes.🧊 Tempered Glass Easy CleanHigh temperature resistant and easy to clean. Professional grade.📱 Perfect for BGA CPU IC RepairSuitable for glue removal and pin repair. Essential motherboard tool.

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