MECHANIC M35 Nano Flux Paste Lead Free High Performance Solder Flux for Mobile Phone IC Chip BGA Motherboard Repair

MECHANIC M35 Nano Flux Paste Lead Free High Performance Solder Flux for Mobile Phone IC Chip BGA Motherboard RepairMECHANIC M35 Nano Flux Paste 10CC, high‑activity no‑clean soldering flux with low fogging, comes with 3 replaceable needles, perfect for mobile phone chip BGA reballing and motherboard welding repair.✔ Imported eco‑friendly formula, high‑activity soldering flux with reliable de‑oxidizing capacity✔ No‑clean design, low fogging under heating, no complicated post‑weld cleaning required✔ Low‑impurity pure paste, reduces potential corrosion risk for mainboards and chips✔ Syringe‑type package with 3 replaceable needles, realize precise flux application for tiny components✔ Suitable for phone chip reballing, motherboard welding and various precision electronic repair work