MECHANIC | MECHANIC XG Series 183℃ Solder Tin Paste Precision Soldering Flux For BGA IC Chip PCB Motherboard Repair

MECHANIC XG Series 183℃ Solder Tin Paste Precision Soldering Flux For BGA IC Chip PCB Motherboard RepairProduct OverviewMECHANIC XGSP Series Solder Paste is a high-performance, no-clean, lead-free solder paste engineered for precision electronic soldering and repair. Formulated with an ultra-fine particle size of 20-38um, it ensures excellent printability and solder joint formation, even on the smallest and most complex components like BGAs and microchips. Operating at a medium melting temperature of 183℃, it offers a good balance between activity and stability, minimizing thermal damage to sensitive electronic parts. This solder paste is CE certified, reliable, and widely used in professional mobile phone repair and electronic manufacturing.Core FeaturesUltra-Fine Particle Size (20-38um): Ensures smooth printing, good solderability, and the formation of reliable, bright solder joints for fine-pitch components.No-Clean & Lead-Free: Environmentally friendly formula requires no cleaning after soldering, leaving no harmful residues, thus improving efficiency and protecting the environment.Medium Temperature (183℃): Low melting point reduces thermal stress on sensitive components like CPUs and motherboards, preventing damage during soldering.Excellent Stability: Long working life and stable performance, both in storage and on the production line, ensuring consistent results.Strong Wettability: The flux component provides excellent wetting, ensuring the solder flows evenly and adheres well to the pads and component leads.Multiple Weights: Available in various convenient sizes (16g, 20g, 30g, 35g, 42g, 60g) to meet different usage needs and reduce waste.Application ScopePrecision soldering and rework of mobile phone motherboards, BGA chip reballing and installation, laptop and tablet PCB repair, soldering of electronic components, and professional electronic maintenance workshops.