RELIFE Multi Purpose BGA Reballing Stencil 0.3/0.35/0.4/0.5mm Universal CPU Solder Net for Phone Motherboard IC Repair

RELIFE Multi Purpose BGA Reballing Stencil 0.3/0.35/0.4/0.5mm Universal CPU Solder Net for Phone Motherboard IC RepairRELIFE Multi-Purpose BGA Stencil is a professional reballing tool designed for mobile phone motherboard and micro electronic repair.Made from high-quality stainless steel, this universal solder stencil provides accurate positioning and stable performance during BGA chip reballing.With multiple hole sizes including 0.3mm, 0.35mm, 0.4mm and 0.5mm, it supports different IC chip repair requirements. The precision mesh design ensures even solder paste distribution and improves repair efficiency.Suitable for professional technicians working on smartphone motherboards, IC chips, and PCB maintenance.